Daniel Golle ac783b419b mvebu: improve thermal management of IEI Puzzle devices ... - Make step_wise thermal governor respect hysteresis This is done by importing a downstream patch, backporting the same feature now present in Linux v6.10+ would be too messy. - Introduce thermal zone for the WT61P803 uC (chassis and board sensors) - Introduce thermal zones for AQR NBase-T PHYs - No longer modify existing SoC thermal zones (which are now only in charge for emergency shutdown, and can be interrupt driven instead of polled) Signed-off-by: Daniel Golle <daniel@makrotopia.org> Signed-off-by: Christian Marangi <ansuelsmth@gmail.com>		2024-06-01 16:40:10 +01:00
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imagebuilder	imagebuilder: fix broken IB_STANDALONE option	2024-05-31 15:48:00 +02:00
linux	mvebu: improve thermal management of IEI Puzzle devices	2024-06-01 16:40:10 +01:00
llvm-bpf	build: use zstd for IB, toolchain, SDK and LLVM compression	2024-04-13 08:05:04 +02:00
sdk	build: use zstd for IB, toolchain, SDK and LLVM compression	2024-04-13 08:05:04 +02:00
toolchain	build: use zstd for IB, toolchain, SDK and LLVM compression	2024-04-13 08:05:04 +02:00
Config.in	loongarch64: new target	2024-05-04 14:14:16 +08:00
Makefile	build: add $(STAGING_DIR) and $(BIN_DIR) preparation to target and package subdir compile dependencies	2024-03-03 23:13:59 +01:00